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Professor
Junfa Mao
 

 

Junfa Mao , Chair Professor
SEIEE Buildings 3-211
Shanghai JiaoTong University
800 Dongchuan Road, Shanghai 200240, China
Tel: +86 21 34204727
Email: jfmao@sjtu.edu.cn
Biography
    Junfa Mao was born in 1965. He received the B.S. degree in radiation physics from the University of Science and Technology of National Defense, China, in 1985, the M.S. degree in experimental nuclear physics form Shanghai Institute of Nuclear Research, Shanghai, China, in 1988, and the Ph.D. degree in electronic engineering from Shanghai Jiao Tong University, Shanghai, China, in 1992.

    Since 1992, he has been a Faculty Member in Shanghai Jiao Tong University, Shanghai, China, where he is currently a chair professor and the Executive Dean of the School of Electronic, Information and Electrical Engineering. He was a visiting scholar at the Chinese University of Hong Kong, Hong Kong, from 1994 to 1995, and a postdoctoral researcher at the University of California, Berkeley, from 1995 to 1996. His research interests include the interconnect and package problem of integrated circuits and systems, analysis and design of microwave circuits. He has authored or coauthored more than 190 journal papers (including 80 IEEE journal papers) and 120 international conference papers.

    Dr. Mao is an Associate Director of the Microwave Society of China Institute of Electronics, the 2007–2009 Chair of the IEEE Shanghai Section,the 2009-2012 Chair of IEEE MTT-S Shanghai Chapter.
Honors
  1. IEEE Fellow (MTT Society) 2011
  2. National Science and Technology Advancement Award of China 2012
  3. National Technology Invention Award of China 2008
  4. National Natural Science Award of China in 2004
  5. Best Paper Award of 2008 the Symposium of APEMC in conjunction with 19th International Symposium of Zurich EMC
  6. Chief scientist of The National Basic Research Program (973 Program) of China
  7. Project leader of the National Science Foundation for Creative Research Groups of China
  8. Cheung Kong Scholar of the Ministry of Education, China
Research Areas
  1. Interconnet and packaging of integrated circuits
  2. Microwave circuits and EMC
Selected Publications
  1. M. S. Zhang, H. Z. Tan, and J. F. Mao, "Worst case power noise estimation and compensation design for zero coupling with multiple switching I/Os," IEEE Transactions on Electromagnetic Compatibility, vol. 54, pp. 1105-1111, Oct. 2012
  2. W. Luo, W. Y. Yin, M. D. Zhu, J. F. Mao, and J. Y. Zhao, "Investigation on time- and frequency-domain responses of some complex composite structures in the presence of high-power electromagnetic pulses," IEEE Transactions on Electromagnetic Compatibility, vol. 54, pp. 1006-1016, Oct. 2012
  3. B. Xia, L. S. Wu, and J.-F. Mao, "A new balanced-to-balanced power divider/combiner," IEEE Transactions on Microwave Theory and Techniques, vol. 60, pp. 2791-2798, Sep. 2012
  4. S. W. Ren, H. L. Peng, J. F. Mao, and A. M. Gao, "Compact quasi-elliptic wideband bandpass filter using cross-coupled multiple-mode resonator," IEEE Microwave And Wireless Components Letters, vol. 22, pp. 397-399, Aug. 2012
  5. Y. Huang, L. S. Wu, M. Tang, and J. F. Mao, "Design of a beam reconfigurable THz antenna with graphene-based switchable high-impedance surface," IEEE Transactions on Nanotechnology, vol. 11, pp. 836-842,  July 2012
  6. W. T. Chen, G. B. Xiao, S. Xiang, and J. F. Mao, "A note on the construction of synthetic basis functions for antenna arrays," IEEE Transactions on Antennas and Propagation, vol. 60, pp. 3509-3512, July 2012
  7. L. S. Wu, B. J. F. Mao, and W. Y. Yin, "A half-mode substrate integrated waveguide ring for two-way power division of balanced circuit," IEEE Microwave And Wireless Components Letters, vol. 22, pp. 333-335, July 2012
  8. L. Jiang, J. F. Mao, and K. W. Leung, "A CMOS UWB on-chip antenna with a MIM capacitor loading AMC," IEEE Transactions on Electron Devices, vol. 59, pp. 1757-1764, June 2012.
  9. D. T. Li, J. F. Mao, "A Koch-like sided fractal bow-tie dipole antenna," IEEE Transactions on Antennas and Propagation, vol. 60, pp. 2242-2251, May 2012
  10. H. R. Zhu, J. F. Mao, "Miniaturized tapered EBG structure with wide stopband and flat passband," IEEE Antennas and Wireless Propagation Letters, vol. 11, pp. 314-317, 2012.
  11. J. J. Li, J. F. Mao, and M. Tang, "Mushroom-type ground plane structure for wideband SSN suppression in high-speed circuits," IEEE Microwave And Wireless Components Letters, vol. 21, pp. 646-648, Dec. 2011
  12. L. L. Jiang, Y. H. Cheng, and J. F. Mao, "Analysis and optimization of thermal-driven global interconnects in nanometer design ," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, pp. 1564-1572, Oct. 2011
  13. H. Li, N.  Srivastava, J. F. Mao, W. Y. Yin, and K. Banerjee, "Carbon nanotube vias: does ballistic electron–phonon transport imply improved performance and reliability?" IEEE Transactions on Electron Devices, vol. 58, pp. 2689-2701, Aug. 2011
  14. L. S. Wu, Y. X. Guo, J. F. Mao, and W. Y. Yin, "Design of a substrate integrated waveguide balun filter based on three-port coupled-resonator circuit model," IEEE Microwave and Wireless Components Letters, vol. 21, pp. 252-254, May 2011
  15. Q. T. Lai, J. F. Mao, and M. S. Zhang, "Compensation design for DC bocking multilayer ceramic capacitor (MLCC) in high-speed applications," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 742-751, May 2011.
  16. X. C. Li, J. F. Mao, and M. Swaminathan, "Transient analysis of CMOS-gate-driven interconnects based on FDTD," IEEE Transactions on Compuer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574-583, April. 2011.
  17. M. S. Zhang, J. F. Mao, and Y. L. Long, "Power noise suppression using power-and-ground via pairs in multilayered printed circuit boards," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, pp. 374-385, March 2011
  18. M. S. Zhang and J. F. Mao, "A new systematic method for the modeling, analysis and design of high-speed power delivery networks by using distributed port," IEEE Transactions on Microwave Theory and Techniques, vol. 58, no. 11, pp. 2940-2951, Nov. 2010
  19. B. Zhang, G. B. Xiao, J. F. Mao and Y. Wang, "Analyzing large-scale non-periodic arrays with synthetic basis functions," IEEE Transactions on Antennas and Propagation,vol.58, no.11, pp.3576-3584. Nov. 2010.
  20. H. L. Peng, W. Y. Yin, J. F. Mao, and Y. T. Xie, "A compact single/dual-polarized broadband antenna with SUM and difference beam capabilities," IEEE Antennas and Wireless Propagation Letters, vol. 9, pp.990-993, Nov. 2010.
  21. L.S.Wu, X. L. Zhou, W.-Y. Yin, L. Zhou, and J. F. Mao, "A novel substrate integrated evanescent-mode waveguide filter with non-resonating node in low temperature co-fired ceramic," IEEE Transactions on Microwave Theory and Techniques, vol. 58, no. 10, pp. 2654-2662, Oct.. 2010
  22. C. T. Liu, J. F. Mao, "A new power-ground plane modeling method with rectangle and triangle segmentation," IEEE Transactions on Advanced Packaging, vol. 33, no. 3, pp.639-646, Aug. 2010.
  23. F. Z. Kong, W. Y. Yin, J. F. Mao, and Q. H. Liu, "Electro-thermo-mechanical characterizations of various wire bonding interconnects illuminated by an electromagnetic pulse," IEEE Transactions on Advanced Packaging, vol. 33, no. 3, pp. 729-737, Aug. 2010.
  24. L. Li, Z. F. Li, and J. F. Mao, "Compact lowpass filters with sharp and expanded stopband using stepped impedance hairpin units," IEEE Microwave And Wireless Components Letters, vol. 20, no. 6, pp. 310-312, June 2010
  25. Q. T. Lai and J. F. Mao, "A 0.5-11 GHz CMOS low noise amplifier using dual-channel shunt technique," IEEE Microwave And Wireless Components Letters, vol. 20, no. 5, pp. 280-282, May 2010
  26. M. Tang, J. F. Mao, "Finite-difference analysis of interconnects with frequency-dependent parameters based on equivalent circuit models," IEEE Transactions on Advanced Packaging, vol. 33, no. 2, pp. 457-467, May 2010.
  27. L. S. Wu, X. L. Zhou, W. Y. Yin, C. T. Liu, L. Zhou, J. F. Mao, and H. L. Peng, "A new type of periodically loaded half-mode substrate integrated waveguide and its applications," IEEE Transactions on Microwave Theory and Techniques, vol. 58, no. 4, pp. 882-893, Apr. 2010.
  28. Q. F. Liu, W. Y. Yin, M. Tang, P. G. Liu, J. F. Mao, and Q. H. Liu "Time-domain investigation on cable-induced transient coupling into metallic enclosures," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 4, pp. 953-962, Nov. 2009.
  29. W. Shen, L. S. Wu, X. W. Sun, W. Y. Yin, and J. F. Mao, "Novel substrate integrated waveguide filters with mixed cross coupling (MCC)," IEEE Microwave And Wireless Components Letters, vol. 19, no. 11, pp. 701-703, Nov. 2009.
  30. G. B. Xiao, J. F. Mao, and L. Zhou, "Generalized transition matrix for a multilayered scatterer with arbitrary interfaces," IEEE Transactions on Antennas and Propagation, vol. 57, no. 10 (part 2), pp. 3434-3438, Oct. 2009.
  31. Y. B. Shi, W. Y. Yin, J. F. Mao, and Q. H. Liu, "Transient electrothermal analysis of multilevel interconnects in the presence of ESD pulses using the nonlinear time-domain finite-element method," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 3 (part 2), pp. 774-783, Aug. 2009.
  32. W. Shen, X. W. Sun, W. Y. Yin, J. F. Mao, and Q. F. Wei, "A novel single-cavity dual mode substrate integrated waveguide filter with non-resonating node," IEEE Microwave And Wireless Components Letters, vol. 19, no. 6, pp. 368-370, June 2009.
  33. Q. F. Liu, W. Y. Yin, M. F. Xue, J.-F. Mao, and Q. H. Liu, "Shielding characterization of metallic enclosures with multiple slots and a thin-wire antenna loaded: multiple oblique EMP incidences with arbitrary polarizations," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 2, pp. 284-292, May 2009.
  34. Q. F. Liu, W. Y. Yin, J.-F. Mao, and Z. Z. Chen, "Accurate characterization. of shielding effectiveness of metallic enclosures with thin wires and thin slots," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 2, pp. 293-300, May 2009.
  35. G.. B. Xiao, J. F. Mao, "Generalized transition matrix for arbitrarily shaped scatterers with composite structures," IEEE Transactions on Electromagnetic Compatibility, vol. 51, no. 2, pp. 401-405, May 2009.
  36. S. N. Pu, W. Y. Yin, J. F. Mao, and Q. H. Liu, "Crosstalk prediction of single- and double-walled Carbon-nanotube (SWCNT/DWCNT) bundle interconnects," IEEE Transactions on Electron Devices, vol. 56, no. 4, pp. 560-568, April 2009.
  37. G. B. Xiao, J. F. Mao, and B. Yuan, "A generalized surface integral equation formulation for analysis of complex electromagnetic systems," IEEE Transactions on Antennas and Propagation, vol. 57, no. 3, pp. 701-710, March 2009.
  38. B. T. Jiang, J. F. Mao, and W. Y. Yin, "An efficient ladder reflector antenna for interchip communications," IEEE Antennas and Wireless Propagation Letters, vol. 7, pp. 777-780, Dec. 2008.
  39. G. B. Xiao, J. F. Mao, and B. Yuan, "Generalized transition matrix for arbitrarily shaped scatterers or scatterer groups," IEEE Transactions on Antennas and Propagation, vol. 56, Dec. 2008.
  40. L. Lin, W. Y. Yin, J. F. Mao, and K. Yang, "Performance characterization of circular silicon transformers," IEEE Transactions on Magnetics, vol. 44, pp. 4684-4688, Dec. 2008
  41. K. Yang, W. Y. Yin, J. L. Shi, K. Kang, J. F. Mao, and Y. P. Zhang, "A study of on-chip stacked multi-loop spiral inductors," IEEE Transactions Electron Devices, vol. 55, pp. 3236-3245, Nov. 2008
  42. M. F. Xue, W. Y. Yin, Q. F. Liu, and J. F. Mao, "Wideband pulse respones of metallic rectangular multi-stage cascaded enclosures illuminated by an EMP," IEEE Transactions Electromagnetic Compatibility,vol. 50, no. 3, pp. 928-939, Nov. 2008.
  43. H. Li, W. Y. Yin, K. Banerjee, and J. F. Mao, "Circuit modeling and performance analysis of multi-walled carbon nanotube(MWCNT) interconnects," IEEE Transactions Electron Devices, vol. 55, no. 6, pp. 1328-1337, Jun. 2008.
  44. J. F. Xu, W. Y. Yin, J. F. Mao, and L. W. Li, "Thermal transient response of GaAs FETs under intentional electromagnetic interference(IEMI)," IEEE Transactions Electromagnetic Compatibility, vol. 50, no. 2, pp. 340-346, May 2008.
  45. W. Y. Yin, J. Y. Xie, K. Kang, J. L. Shi, J. F. Mao, and X. W. Sun, "Vertical topologies of miniature multi-spiral stacked inductors," IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 2, pp. 475-486, Feb. 2008.
  46. M. Tang and J. F. Mao, "A precise time-step integration method for transient analysis of lossy nonuniform transmission lines," IEEE Transactions on Electromagnetic Compatibility, vol. 50, pp. 166-174, Feb. 2008.
  47. X. C. Li, J. F. Mao, and W. Y. Yin, "Dynamic power model of CMOS gate driving transmission lines based on fourier analysis," IEEE Transactions on Electron Devices, vol. 55, no. 2, pp. 594-600, Feb. 2008.
  48. W. Y. Yin, K. Kang, and J. F. Mao, "Electromagnetic-thermal characterization of on-chip coupled (a)symmetrical interconnects," IEEE Transactions on Advanced Packaging, vol. 30, pp. 851-863, Nov. 2007.
  49. L. Lin, W. Y. Yin, J. F. Mao, and Y. Y. Wang, "New differential stacked spiral inductor on silicon with its application in VCO," IEEE Microwave and Wireless Components Letter, vol. 17, pp. 727-729, Oct. 2007.
  50. L. L. Jiang, Z. Z. Chen, and J. F. Mao, "On the numerical stability of the precise integration time-domain (PITD) method," IEEE Microwave and Wireless Components Letters, vol. 17, pp. 471-473, July. 2007
  51. J. L. Shi, W. Y. Yin, K. Kang, J. F. Mao, and L. W. Li, "Frequency-thermal characteristics of on-chip transformers with patterned ground shields," IEEE Transactions on Microwave Theory and Techniques, vol. 55, pp. 1-12, Jan. 2007.
  52. J. F. Xu, W. Y. Yin, and J. F. Mao, "Transient thermal analysis of GaN heterojunction transistors (HFETs) for high-power applications", IEEE Microwave And Wireless Components Letters, vol. 17, pp. 55~57, Jan. 2007
  53. H. Li, W. Y. Yin, and J. F. Mao, Comments on "Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 25, pp. 3042-3044, Dec. 2006.
  54. L. L. Jiang, J. F. Mao and X. L. Wu, "Symplectic finite-difference time-domain method for Maxwell equations," IEEE Transactions on Magnetics, vol. 42, pp. 1991-1995, Aug. 2006.
  55. W. Y. Yin, S. J. Lin, J. F. Mao, and L. W. Li, "Experimental characterization of hybrid temperature and frequency effects on the performance of transformers on silicon substrates, " IEEE Transactions on Magnetics, vol. 42, pp. 2107-2109, Aug. 2006.
  56. S. J. Lin, W. Y. Yin, H. L. Liao, and J. F. Mao, "The enhancement of Q factor for patterned ground inductor at high temperature," IEEE Transactions on Magnetics, vol. 42, pp. 1873-1875, July 2006.
  57. M. Tang; J. F. Mao and X. C. Li, "Analysis of interconnects with frequency- dependent parameters by differential quadrature method," IEEE Microwave and Wireless Components Letters, vol. 15, pp. 877-879, Dec. 2005.
  58. X-C Li, J. F. Mao, H. Huang, and Y. Liu, "Global interconnect width and spacing optimization for latency, bandwidth and power dissipation," IEEE Transactions on Electronics Device, vol. 52, pp. 2272-2279, Oct. 2005.
  59. W. Y. Yin, X. T. Dong, J. F. Mao, and L. W. Li, "Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges," IEEE Microwave and Wireless Components Letters, vol. 15, pp. 715-717, Oct. 2005.
  60. H. F. Huang, J. F. Mao, X. C. Li, and Z. F. Li, "A photonic bandgap microstrip filter based on YBCO superconducting film," IEEE Transactions on Applied Superconductivity, vol. 15, no. 3, pp. 3827-3830, Sept. 2005.
  61. W. Dai, Z. F. Li, and J. F. Mao, "Parameter extraction for on-chip interconnects by double-image green’s function method combined with hierarchical algorithm," IEEE Transactions on Microwave Theory and Techniques, vol. 53, pp. 2416-2423, July 2005.
  62. H.. W. Liu, Z. F. Li, X. W. Sun, and J. F. Mao, "Harmonic suppression with photonic bandgap and defected ground structure for a microstrip patch antenna," IEEE Microwave and Wireless Components Letters, vol.15, pp. 55-56, Feb. 2005.
  63. X.-C. Li, Z.-F. Mao, and H.-F. Huang,"Accurate analysis of interconnect trees with distributed RLC model and moment matching," IEEE Transactions on Microwave Theory and Techniques, vol. 52,pp. 2199-2206,Sept 2004.
  64. H. W. Liu, Z. F. Li, X. W. Sun, and J. F. Mao, "An improved 1-D periodic defected ground structure for microstrip line," IEEE Microwave and Wireless Components Letters, vol. 14, pp. 180-182, April 2004.
  65. H. F. Huang, and J.F. Mao, "The inductance model of coupled high Tc superconducting microstrip lines," IEEE Transactions on Applied Superconductivity, vol. 14, pp. 7-12, Mar. 2004.
  66. L. Y. Li and J. F. Mao, "An improved compact 2-D finite-difference frequency-domain method for guided wave structures," IEEE Microwave and Wireless Components Letters, vol. 13, pp. 520-522, Dec. 2003.
  67. J. X. Zhao and J. F. Mao, "Inductance extraction for planar spiral inductor by domain decomposition method for conformal modules," IEEE Transactions on Microwave Theory and Techniques, vol. 51, pp. 1763-1766, June 2003.
  68. X. P. Yang, Z. F. Li, and J. F. Mao, "Analysis of the bounces on the power/ground plane structures by planar circuit model and APA-E algorithm," IEEE Transactions on Advanced Packaging, vol. 24, pp.184-190, May 2001.
  69. J. F. Mao, X. N. Qian, and Z. Y. Yuan, "Characteristic analysis of coupled HTS interconnects with two-dimensional FDTD," IEEE Microwave and Wireless Components Letters, vol. 11, pp. 33-35, Jan. 2001.
  70. Q. W. Xu, Z. F. Li, J. Wang and J. F. Mao, "Transient analysis of lossy interconnects by modified method of characteristics," IEEE Transactions on Circuits and System (Part I), vol. 47, pp. 363-375, March 2000.
  71. Y. Cao, Z. F. Li, J. F. Mao and J. F. Mao, "A PEEC with a new capacitance model for circuit simulation of interconnects and packaging structures," IEEE Transactions on Microwave Theory and Techniques, vol. 48, pp. 281-287, Feb. 2000.
  72. Q. W. Xu, Z. F. Li, P. Mazumder and J. F. Mao, "Time-domain simulation of high-speed interconnect systems by a modified method of characteristics," IEEE Transactions on Microwave Theory and Techniques, vol. 48, pp. 323-327, Feb. 2000.
  73. Q. W. Xu, Z. F. Li, and J. F. Mao, "Modeling of transmission lines by differential quadrature method," IEEE Microwave and Guided Wave Letters, vol. 9, pp. 145-147, April 1999.
  74. J. F. Mao, "Twofold Mur’s first-order ABC in the FDTD method," IEEE Transactions on Microwave Theory and Techniques, vol. 46, pp. 299-301, March 1998.
  75. J. F. Mao and O.Wing, "Time-domain transmission matrix of lossy transmission lines," IEEE Microwave and Guided Wave Letters, vol. 8, pp.90-92, Feb. 1998.
  76. J. F. Mao and E. S. Kuh, "Fast simulation and sensitivity analysis of lossy transmission lines by the method of characteristics," IEEE Transactions on Circuits and System (part I), vol. 44, pp. 391-401, May 1997.
  77. J. F. Mao, O. Wing, and F. Y. Chang, "Synthesis of coupled transmission lines," IEEE Transactions on Circuits and System (Part I), vol. 44, pp. 327-337, April 1997.
  78. J. F. Mao, O. Wing, and F. Y. Chang, "Transmission line synthesis by the method of characteristics," IEEE Transactions on Circuits and System (Part I), vol. 43, pp. 461-468, June 1996.
  79. J. F. Mao and Z.-F. Li, "Waveform relaxation solution of the ABCD matrices of nonuniform transmission lines for transient analysis," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 13, pp. 1409-1412, Nov. 1994.
  80. J. F. Mao and Z. F. Li, "Analysis of the time response of nonuniform multiconductor transmission lines with a method of equivalent cascaded network chain," IEEE Transactions on Microwave Theory and Techniques, vol. 40, pp. 948-954, May 1992.
  81. J. F. Mao and Z. F. Li, "Analysis of the time response of multiconductor transmission lines with frequency-depend losses by the method of convolution characteristics," IEEE Transactions on Microwave Theory and Techniques, vol. 40, pp. 637-644, April 1992.
Books and Patents
  1. 1 books and 1 book chapter
  2. 16 invention patents
Courses
  1. 《Modern Physics for Electronics》 for undergraduate students each year
  2. 《Circuit Analysis of High-Speed Circuits》 for doctoral graduate students each year
Active Grants & Projects
  1. Basic Research on System in Package, 973 project, 2009-2013
  2. Co Analysis and Design of Electronic-Thermal-Stress Performance for System in Package of High-Speed Integrated Circuits, Key project of NSFC, 2013-2017
Editorships
    Associate Editor for the Frontiers of Electrical and Electronic Engineering

 

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