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Li XiaochunProfessor
Address：
Phone：+86 21 34205350
Email：lixc@sjtu.edu.cn
Research Center：Microwave and Radio Frequency Technology Research Center
Personal Home Page：hsic.sjtu.edu.cn
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ResearchDirection
high-speed and microwave circuits, interconnection technology, electromagnetic compatibility and other research work
Selected Publications
[1] Yan Shao, Xiao-Chun Li, Ning Wang, Lin-Sheng Wu, Min Tang and Jun-Fa Mao, “Theoretical and Experimental Investigation of HMSIW-Based High-Speed Data Transmission System Using QPSK Scheme,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, issue. 11, pp.1938-1947, Nov. 2018.
[2] Wang N., Li X. C., Mao J. F.，“High-Speed Interconnect System Using QPSK Scheme Based on Substrate Integrated Waveguide，”Journal of Circuits Systems and Computers, vol. 27, issue 1, pp: 19, 2018.
[3] Yan Shao, Xiao-Chun Li, Lin-Sheng Wu, Jun-Fa Mao, “A Wideband Millimeter-Wave Substrate Integrated Coaxial Line (SICL) Array for High-Speed Data Transmission,” IEEE Transactions on Microwave Theory and Techniques, vol. 65, No.8, pp.2789-2800, Aug. 2017.
[4] Xin Tan, Xiao-Chun Li, Junfa Mao, “Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, No.2, pp.269 - 275, Feb. 2017.
[5] Ning Wang, Xiao-Chun Li, Jun-fa Mao, “Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance,” IEEE Transactions on Electron Devices, vol. 62, no.8, pp.2579-2586, Aug. 2015.
[6] Xiao-chun Li, Jun-fa Mao, and Swaminathan Madhavan, “Transient Analysis of CMOS-Gate-Driven RLGC Interconnects Based on FDTD,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574 – 583, Apr. 2011.
[7] Xiao-chun Li, Mao, Jun-Fa, “An area-efficient very large scale integration architecture for modified Euclidean algorithm with dynamic storage technique,” International Journal of Electronics, 96(8), pp 837-842, Jun. 2009.
[8] Xiao-chun Li, Jun-fa Mao, Wen-yan Yin, “Dynamic Power Model of CMOS Gates Driving Transmission Lines Based on Fourier Analysis,” IEEE Transactions on Electron Devices, vol. 55, no. 2, pp.594-560, Feb. 2008.
[9] Xiao-chun Li, Mao Jun-fa, Huang Hui-fen and Liu Ye, “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation,” IEEE Transactions on Electron Devices, 2005, vol. 52, no. 10, pp. 2272–2279, Oct. 2005.
[10] Xiao-chun Li and Jun-fa Mao, “Accurate Analysis of Interconnect Trees with Distributed RLC Model and Moment Matching”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, no.9, pp. 2199 – 2206, Sept. 2004.
[11] Min Tang, Jun-Fa Mao and Xiao-chun Li, “Analysis of Interconnects with Frequency-Dependent Parameters by Differential Quadrature Method,” IEEE Microwave and Wireless Components Letters, vol.15, no.12, pp. 877-879, Dec. 2005.
[12] Hui-Fen Huang, Jun-Fa Mao, Xiao-chun Li, andZhengfan Li, “A photonic bandgap microstrip filter based on YBCO superconducting film,” IEEE Transactions on Applied Superconductivity, vol.15, no.3, pp. 3827–3830, Mar. 2005.
[13] Feng Cheng, Junfa Mao, and Xiao-chun Li, “Timing-driven placement based on path topology analysis,” IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E88, no. 8, pp. 2227–2230, Aug. 2005.
[14] Xiao-chun Li and Junfa Mao, “A New Delay Model for Distributed RLC Trees,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 259–271, Jan. 2006.
[15] Xiao-chun Li and Junfa Mao, “An Area-Efficient Euclid Architecture with Low Latency,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 221–227, Jan. 2006.
[16] 裴子溦，李晓春，毛军发，“基于FDTD的约瑟夫森结与超导传输线协同分析方法，”电子学报，2019（录用）。
[17] Wei sun, Xiao-Chun Li, Jun-Fa Mao,“Time-Domain Analysis of Noise in Power/Ground Planes with Narrow Slots Based on WLP-FDTD,”Journal of Shanghai Jiaotong University, 2018 (Accept).
[18] Xiangting, Wang, Xiao-Chun Li, Jun-Fa Mao, “An EBG Microstrip Line Interconnect with Noise Suppression,”Journal of Shanghai Jiaotong University, 2018 (Accept).
[19] 李晓春 ; 毛军发 , 基于基片集成波导的高速电子系统互连技术, 中国科学：信息科学, 2018.9, 页码：1165-1182.
[20] Zhen Wei, Xiaochun Li, and Junfa Mao， “An accurate RLGC circuit model for dual tapered TSV structure,” Journal of Semiconductors, vol.35, no.9, pp. 136-142，Sept. 2014.
[21] Li-Mei Shen, Xiao-Chun Li, Jun-Fa Mao , “16QAM high-speed transmission system using substrate integrated waveguide-type interconnect,” Journal of Shanghai Jiaotong University, vol.48, issue.10, pp. 1368-1371, Oct. 2014.