[1] 华为技术有限公司：“集成化FMCW激光雷达关键技术”， 主要负责硅/氮化硅外腔激光器设计、器件封装、系统测试，基于外腔激光器和自注入锁定激光器产生FMCW信号，经费293万元，起止日期：2019.07-2021.06，已结题；

[2] 中国电子科技集团第27所：“片上可调谐激光发射技术”，主要负责外腔激光器设计、封装、测试，经费110万元，起止日期：2020.01-2020.12，已结题；

[3] 国家自然科学基金重大项目子课题“高线性度硅基调频连续波光发射芯片研制”，主要负责硅基激光器部分方案设计，经费450万元，起止日期：2021.01-2025.12，在研；

[4] 科技部重点研发项目子课题：“激光器阵列片上集成与复用器的研究”，负责O波段多通道硅基混合集成激光器子课题，集成四通道RSOA阵列产生四路外腔激光，经费300万元，起止日期：2020.01-2021.12，已结题。

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