唐旻，教授，博士生导师。上海市优秀学术带头人，IEEE MTT-S上海分会主席，中国仿真学会专业委员会委员，中国兵工学会专业委员会委员。近年来，主持国家重点研发项目1项，国家自然科学基金项目3项（重点项目1项），主持其他科研项目30余项。发表SCI/EI检索论文180余篇，出版学术专著1部，获得ISEDA2024、ISEDA2023、APEMC2017、EDAPS2015国际会议最佳论文奖，2019年度中国仿真学会“优秀论文奖”。登记软件著作权18项，授权发明专利6项。代表性成果先后获得2011年上海市科学技术进步一等奖，2012年国家科学技术进步二等奖，2019年上海市科学技术进步一等奖，2020年中国高等学校十大科技进展，2023年国家科学技术进步一等奖。

1. 多物理场仿真技术和EDA工具

2. 射频器件与互连封装结构建模

3. 高性能/多功能封装天线设计

1. 国家科学技术进步一等奖，“射频系统设计自动化关键技术与应用”，2023

2. 中国电子学会创新团队奖，2023

3. 上海职工劳动和技能竞赛一等奖，“半导体异质集成电路项目”，2021

4. 中国高等学校十大科技进展，“射频集成电路EDA关键技术与工具”，2020

5. 上海市科学技术进步一等奖，“射频电路EDA的关键技术研发与应用”，2019

6. 中国仿真学会“优秀论文奖”，2019

7. 国家科学技术进步二等奖，“射频电子系统的三维高密度封装技术及其应用”，2012

8. 上海市科学技术进步一等奖，“射频系统级封装技术及其应用”，2011

1. 微波技术，48学时，本科生课程，秋季

2. 高速电路系统的电路分析，32学时，研究生课程，春季

1. 毛军发，唐旻，高速集成电路互连，科学出版社，2017年。

2. 一种基于线性锥削缝隙形式的散热片天线阵结构，专利号：ZL202110794721.4，发明人：唐旻，钱佳唯，毛军发

3. 一种散热片天线阵结构，专利号：ZL201911008244.3，发明人：唐旻，钱佳唯，张跃平，毛军发

4. 一种基于阶梯阻抗传输线的键合线阻抗匹配方法，专利号：201810481356.X，发明人：唐旻，蒋万里，毛军发

5. 一种基于自适应更新基准值的光纤瞬断特性信息提取系统，专利号：ZL201611232711.7，发明人：蒋万里，唐旻

6. 一种用于光纤瞬断检测系统的宽带低噪声模拟前端电路，专利号：ZL201611232684.3，发明人：蒋万里，唐旻

7. 系统级封装电源完整性设计的混合网格划分方法，专利号：ZL201010523544.8，发明人：刘春天，毛军发，唐旻

[1] Meini Wang, Zijian Shao, Min Tang*, Yueping Zhang, Junfa Mao, “Miniaturization and Decoupling of Wideband Stacked Patch Antennas Based on Spoof Surface Plasmon Polaritons,” IEEE Transactions on Antennas and Propagation, vol. 72, no. 10, pp. 8076-8081, Oct. 2024.
[2] Bo Li, Min Tang*, Junfa Mao, “An Efficient LBFEM-POD Scheme for Transient Thermomechanical Simulation of Electronic Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 8, pp. 1403-1412, Aug. 2024.
[3] Binshan Zhao, Min Tang*, Yue-Ping Zhang, Junfa Mao, “Wideband Decoupling of Zero Edge Spacing Laminated Resonator Antenna Array,” IEEE Transactions on Antennas and Propagation, vol. 72, no. 8, pp. 6481-6490, Aug. 2024.
[4] Zehao Zheng, Min Tang*, Lin-Sheng Wu, Liang-Feng Qiu, Junfa Mao, “Efficient Electro-Thermal Analysis of SIW Filters Considering Temperature-Dependent Characteristics of Materials,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 6, pp. 1079-1088, Jun. 2024.
[5] Jie Li, Min Tang*, Lin-Sheng Wu, Liguo Jiang, Wenliang Dai, Junfa Mao, “LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages,” IEEE Journal on Multiscale and Multiphysics Computational Techniques, vol. 9, pp. 149-156, Apr. 2024.
[6] Meini Wang, Zijian Shao, Min Tang*, Yueping Zhang, Junfa Mao, “Design of Miniaturized Low Cross-Polarization Quarter-Wave Patch Antennas Using Gradient Spoof Surface Plasmon Polaritons,” IEEE Antennas and Wireless Propagation Letters, vol. 23, no. 3, pp. 1050-1054, Mar. 2024.
[7] Binshan Zhao, Min Tang*, Xiaocheng Wang, Meini Wang, Yue-Ping Zhang, Junfa Mao, “Miniaturized Laminated Resonator Antenna Array Loaded with Periodic Irises in LTCC,” IEEE Transactions on Antennas and Propagation, vol. 72, no. 2, pp. 1449-1458, Feb. 2024.
[8] Jie Li, Min Tang*, Junfa Mao, “An Efficient GADI Method with Unstructured Grids for Transient Thermal Analysis of AlGaN/GaN HEMTs,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 1, pp. 36-42, Jan. 2024.
[9] Zehao Zheng, Min Tang*, Junfa Mao, “Compact Modeling for Average Power Handling Capabilities of Symmetric and Asymmetric Striplines,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 10, pp. 1703-1711, Oct. 2023.
[10] Bo Li, Min Tang*, Ping Li, Jun-Fa Mao, “Efficient Thermal Analysis of Integrated Circuits and Packages with Microchannel Cooling Using Laguerre-Based Layered Finite Element Method,” IEEE Journal on Multiscale and Multiphysics Computational Techniques, vol. 8, pp. 195-204, Apr. 2023.
[11] Qi Xiao, Min Tang*, Junfa Mao, “Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 3, pp. 323-331, Mar. 2023.
[12] Meini Wang, Min Tang*, Hao Chi Zhang, Junfa Mao, “Energy Selective Antenna: Concept, Design, and Experiment,” IEEE Transactions on Electromagnetic Compatibility, vol. 65, no.2, pp. 539-545, Apr. 2023.